Thermal Conductivity: >1.93 W / m-K
Thermal Impedance: <0.225 ℃ -in2 / W
Specific Gravity: >2 g/cm3
Concentration: 380±10 1/10mm
Operating Temperature Range: -30 ~ 300 ℃
Primary Use: Thermal coupling of electrical/electronic devices to heat sinks.
1. Syringe design, for easy operation.
2. Non-toxic,non-corrosive and ordorless.
3. Helps disperse the heat from CPU to heatsink effectively.
4. Water resistance, weather resistance, low oil dispersion, Stable at high temperatures.
1 x CPU Thremal Paste