SpecificationSize: 60x50mm.
Thermal conductivity: >2.0W/M-K
Working temperature: - 50℃ ~ 240℃
Primary Use: Thermal coupling of electrical / electronic device to heat sinks.
Special Properties: High Conductivity ,Low Bleed and Stable at high temperature.
Type: Silicone fluid.
Physical From: Grease-like.
Featuresa.Silver thermal paste
b.Plastic can package
c.Non-toxic,non-corrosive and ordorless
d.Ideal for CPU, graphics card, the heating element usage
Package Included
1×100g Compound Heatsink Thermal Paste
